晶圓側邊標記對位方法
- 經濟部產業技術司–專利資料集 @ 經濟部
專利名稱-中文晶圓側邊標記對位方法的核准國家是美國, 執行單位是工研院機械所, 產出年度是97, 專利性質是發明, 計畫名稱是智慧保全機器人技術研究發展三年計畫, 專利發明人是陳秋旺, 證書號碼是7,390,723.
序號 | 4428 |
產出年度 | 97 |
領域別 | (空) |
專利名稱-中文 | 晶圓側邊標記對位方法 |
執行單位 | 工研院機械所 |
產出單位 | (空) |
計畫名稱 | 智慧保全機器人技術研究發展三年計畫 |
專利發明人 | 陳秋旺 |
核准國家 | 美國 |
獲證日期 | (空) |
證書號碼 | 7,390,723 |
專利期間起 | (空) |
專利期間訖 | (空) |
專利性質 | 發明 |
技術摘要-中文 | 一種晶圓側邊標記對位方法,包含步驟a)提供至少一第一晶圓、至少一第二晶圓,以及至少一感測裝置,該第一晶圓之橫截面上係設有至少一第一圖案與一第二圖案,該第二晶圓之橫截面上係設有至少一第三圖案與一第四圖案,該第一圖案係可與該第三圖案相配合,該第二圖案係可與該第四圖案相配合;b)作動該第一晶圓與該第二晶圓,使該第一晶圓與該第二晶圓彼此平行且相距一間隔;c)作動該第一晶圓與該第二晶圓,使該第一晶圓與該第二晶圓開始彼此接近,同時該感測裝置係進行感測,以確定該第一圖案是否與該第三圖案相配合,且該第二圖案是否與該第四圖案相配合;以及d)若該第一圖案係與該第三圖案相配合,且該第二圖案係與該第四圖案相配合,則接合該第一晶圓與該第二晶圓。 A method for stacking and bonding wafers in precision alignment by detecting alignment marks provided on wafer edges, comprising the steps of: (a) providing at least a first wafer having at least a first pattern and at least a second pattern disposed on the cross-section thereof, at least a second wafer having at least a third pattern and at least a fourth pattern disposed on the cross-section thereof, and at least a sensing device, while pairing the first pattern with the third pattern and pairing the second pattern with the fourth pattern; (b) actuating the first wafer and the second wafer for enabling the first to parallel the second wafer and to be a distance apart from the second wafer; (c) actuating the first wafer and the second wafer for bringing the two wafers to move toward each other while enabling the sensing device for detecting and determining whether or not the first pattern is in a position capable of matching with the third pattern and the second pattern in another position capable of matching with the fourth pattern; (d) bonding the first wafer and the second wafer while the first pattern matches the third pattern and the second pattern matches the f |
技術摘要-英文 | (空) |
聯絡人員 | 李露蘋 |
電話 | 03-59117812 |
傳真 | 03-5917431 |
電子信箱 | oralp@itri.org.tw |
參考網址 | http://www.patentportfolio.itri.org.tw |
備註 | 0 |
特殊情形 | (空) |
同步更新日期 | 2019-07-24 |
序號4428 |
產出年度97 |
領域別(空) |
專利名稱-中文晶圓側邊標記對位方法 |
執行單位工研院機械所 |
產出單位(空) |
計畫名稱智慧保全機器人技術研究發展三年計畫 |
專利發明人陳秋旺 |
核准國家美國 |
獲證日期(空) |
證書號碼7,390,723 |
專利期間起(空) |
專利期間訖(空) |
專利性質發明 |
技術摘要-中文一種晶圓側邊標記對位方法,包含步驟a)提供至少一第一晶圓、至少一第二晶圓,以及至少一感測裝置,該第一晶圓之橫截面上係設有至少一第一圖案與一第二圖案,該第二晶圓之橫截面上係設有至少一第三圖案與一第四圖案,該第一圖案係可與該第三圖案相配合,該第二圖案係可與該第四圖案相配合;b)作動該第一晶圓與該第二晶圓,使該第一晶圓與該第二晶圓彼此平行且相距一間隔;c)作動該第一晶圓與該第二晶圓,使該第一晶圓與該第二晶圓開始彼此接近,同時該感測裝置係進行感測,以確定該第一圖案是否與該第三圖案相配合,且該第二圖案是否與該第四圖案相配合;以及d)若該第一圖案係與該第三圖案相配合,且該第二圖案係與該第四圖案相配合,則接合該第一晶圓與該第二晶圓。 A method for stacking and bonding wafers in precision alignment by detecting alignment marks provided on wafer edges, comprising the steps of: (a) providing at least a first wafer having at least a first pattern and at least a second pattern disposed on the cross-section thereof, at least a second wafer having at least a third pattern and at least a fourth pattern disposed on the cross-section thereof, and at least a sensing device, while pairing the first pattern with the third pattern and pairing the second pattern with the fourth pattern; (b) actuating the first wafer and the second wafer for enabling the first to parallel the second wafer and to be a distance apart from the second wafer; (c) actuating the first wafer and the second wafer for bringing the two wafers to move toward each other while enabling the sensing device for detecting and determining whether or not the first pattern is in a position capable of matching with the third pattern and the second pattern in another position capable of matching with the fourth pattern; (d) bonding the first wafer and the second wafer while the first pattern matches the third pattern and the second pattern matches the f |
技術摘要-英文(空) |
聯絡人員李露蘋 |
電話03-59117812 |
傳真03-5917431 |
電子信箱oralp@itri.org.tw |
參考網址http://www.patentportfolio.itri.org.tw |
備註0 |
特殊情形(空) |
同步更新日期2019-07-24 |