中文貨名: 供半導體晶圓生產使用,以雷射、其他光或光子束切削任何材料加工之機器之零件 | 英文貨名: Parts of machines for working any material by removal of material, by laser or other light or photo ... | 實施日期: 0980101 | 截止日期:
貨品分類號列: 84869000302 | 英文貨名: Parts of machines for working any material by removal of material, by laser or other light or photo ... | 第一欄稅率: 0% | 第二欄稅率: 0% (PA,GT,NI,SV,HN,NZ,SG) | 第三欄稅率: 2.5% | 統計數量單位: | 統計重量單位: KGM
中文貨名: 供半導體晶圓生產使用,以雷射、其他光或光子束切削任何材料加工之機器之零件 | 英文貨名: Parts of machines for working any material by removal of material, by laser or other light or photo ... | 實施日期: 0980101 | 截止日期:
貨品分類號列: 84869000302 | 英文貨名: Parts of machines for working any material by removal of material, by laser or other light or photo ... | 第一欄稅率: 0% | 第二欄稅率: 0% (PA,GT,NI,SV,HN,NZ,SG) | 第三欄稅率: 2.5% | 統計數量單位: | 統計重量單位: KGM