(1) 「純」硬體解碼器: 本矽智財是以專用的硬體電路(fully-hardware-type)來解碼H.264影片，不需要高效能的CPU來分擔解碼工作，也就是說外部 CPU只需對解碼器執行：(a)設定參數，(b)下達解碼指令，(c)查詢狀態，即可完成整個解碼流程，如此簡單的hand-shaking可以讓驅動程式的撰寫變得非常容易。 (2) 支援高解析度影片: 最高可以支援到1920x1088的解析度，而且畫面更新率達到每秒30張循序掃描畫面(progressive)，或是60張交錯畫面(interlaced)，本矽智財可以即時解碼位元率(bitrate)高達50M bps的壓縮影片，完整呈現影片中的高畫質效果。 (3) 完整支援High Profile所有規範: 包含下列解碼工具： - I/P/B-Slice, Interlaced Picture, 8x8 Intra Prediction, and 8x8 Inverse Transform - CABAC, Weighted Prediction, and Customized Quantization Matrix - Picture-level Adaptive Frame-Field (PICAFF) Structure - Macroblock-level Adaptive Frame-Field (MBAFF) Structure 另外，針對H.264在圖像記憶體管理方面的規範，本矽智財除了支援高達30張的參考圖像外，也完整支援全部的記憶體管理指令(Memory Management and Control Operations (MMCO))，完全不需依賴外部的CPU即可達到高效能的解碼能力。
技術現況敘述-英文
(空)
技術規格
1) Device: Altera Stratix (2) Speed Grade: -5 (3) Logic Elements: ~ 50,000 (30% for routing interconnects) (4) Internal Memory: ~ 26,000 Bytes (used as RAMs and FIFOs) (5) DSP Elements: 20 (used as 9-bit x 9-bit multipliers) (6) Timing Constraint for FPGA (fmax): 50 MHz lFully-hardware-type decoder, which is compliant to H.264 Baseline Profile, Level 2 for DVB-H CBMS applications (7) Picture resolution: 352x288 (CIF), 30fps, 2Mbps, YCbCr 420 format (8) Internal memory: 26,000 Bytes (9) Up to 15 reference pictures for H.264 Memory Management and Control Operations(MMCO) (10) Passes ITU-T H.264.1 conformance test(bit exactly matching) (11) Module interfaces compliant to Altera Avalon Bus specification and ready to be modified as AMBA compliant signals (12) FPGA-proven Soft Intellectual Property (IP) for easy customization and adaptation to different applicatio
技術成熟度
量產
可應用範圍
(1) 高解析度數位電視 (2) DVB-H、PMP、多媒體手機等個人隨身的影音播放裝置 (3) Video Codec相關產品領域
(1) 「純」硬體解碼器: 本矽智財是以專用的硬體電路(fully-hardware-type)來解碼H.264影片，不需要高效能的CPU來分擔解碼工作，也就是說外部 CPU只需對解碼器執行：(a)設定參數，(b)下達解碼指令，(c)查詢狀態，即可完成整個解碼流程，如此簡單的hand-shaking可以讓驅動程式的撰寫變得非常容易。 (2) 支援高解析度影片: 最高可以支援到1920x1088的解析度，而且畫面更新率達到每秒30張循序掃描畫面(progressive)，或是60張交錯畫面(interlaced)，本矽智財可以即時解碼位元率(bitrate)高達50M bps的壓縮影片，完整呈現影片中的高畫質效果。 (3) 完整支援High Profile所有規範: 包含下列解碼工具： - I/P/B-Slice, Interlaced Picture, 8x8 Intra Prediction, and 8x8 Inverse Transform - CABAC, Weighted Prediction, and Customized Quantization Matrix - Picture-level Adaptive Frame-Field (PICAFF) Structure - Macroblock-level Adaptive Frame-Field (MBAFF) Structure 另外，針對H.264在圖像記憶體管理方面的規範，本矽智財除了支援高達30張的參考圖像外，也完整支援全部的記憶體管理指令(Memory Management and Control Operations (MMCO))，完全不需依賴外部的CPU即可達到高效能的解碼能力。
技術現況敘述-英文
(空)
技術規格
1) Device: Altera Stratix (2) Speed Grade: -5 (3) Logic Elements: ~ 50,000 (30% for routing interconnects) (4) Internal Memory: ~ 26,000 Bytes (used as RAMs and FIFOs) (5) DSP Elements: 20 (used as 9-bit x 9-bit multipliers) (6) Timing Constraint for FPGA (fmax): 50 MHz lFully-hardware-type decoder, which is compliant to H.264 Baseline Profile, Level 2 for DVB-H CBMS applications (7) Picture resolution: 352x288 (CIF), 30fps, 2Mbps, YCbCr 420 format (8) Internal memory: 26,000 Bytes (9) Up to 15 reference pictures for H.264 Memory Management and Control Operations(MMCO) (10) Passes ITU-T H.264.1 conformance test(bit exactly matching) (11) Module interfaces compliant to Altera Avalon Bus specification and ready to be modified as AMBA compliant signals (12) FPGA-proven Soft Intellectual Property (IP) for easy customization and adaptation to different applicatio
技術成熟度
量產
可應用範圍
(1) 高解析度數位電視 (2) DVB-H、PMP、多媒體手機等個人隨身的影音播放裝置 (3) Video Codec相關產品領域
近年來立體視訊擷取與顯示技術逐日成熟，跟立體視訊編解碼相關的研究也開始熱絡起來，而隨著3D攝影機與3D顯示器的價格逐漸平民化，使得消費性立體視訊的應用日益普及，所以ITU-T也在2010將3D立體高階檔次(Stereo High Profile)增修到H.264 MVC規範中，來支援普及性較高的雙眼立體視訊應用，例如：藍光光碟的3D影片壓縮即是使用H.264的3D立體高階檔次。本技術提供高解析度3D立體視訊硬體解碼器IP，符合MVC Stereo High Profile規範，並且向下相容H.264 High Profile標準，可提供國內廠商高品質3D影像服務所需的關鍵技術，並可與現有成果之編解碼IP相互結合，在單一核心即可支援H.264與MVC規格，進而降低成本並帶動國內3D視訊廠商技術之升級，提昇其國際競爭力。 本計畫的定位在於開發在MVC與High Efficiency Video Coding (HEVC)技術，計畫團隊除了持續關注視訊技術的發展趨勢來開發新技術之外，對既有MPEG-2/4、H.264、Scalable Video Coding (SVC)以及AVS等相關應用領域，也能配合不同的需求來提供最佳化的整合解決方案，達到支援各類研發計畫的目的，並提供產業界完整的視訊編解碼IP。
技術現況敘述-英文
(空)
技術規格
1. Fully-hardware-type decoder, which is compliant to ITU-T: – Stereo High Profile, Level 4.1, for 3D TV applications – Constrained Baseline / Main / High Profiles, Level 4.1, for HDTV applications 2. Picture resolution: 1920x1088p (HD), stereo view 60 fps, 50M bps, YCbCr 420 format (supports YV12 or NV12 format) 3. Supports ALL features in H.264 High Profile: – I/P/B-Slice, Interlaced Picture, 8x8 Intra Prediction, and 8x8 Inverse Transform – CABAC, Weighted Prediction, and Customized Quantization Matrix – Picture-/MB-level Adaptive Frame-Field (PIC-/MB-AFF) Structures – Up to 30 Reference Field-Pictures – Dedicated Hardware for Memory Management and Control Operations (MMCO) 4 Passes ITU-T H.264.1 conformance tests (total 174 cases, bit exactly matching) – Stereo High Profile: 1
技術成熟度
實驗室階段
可應用範圍
3D數位電視、多媒體手機等個人隨身的3D影音播放裝置、3D Video Codec相關產品領域、視訊串流與監控關鍵零組件。
技術現況敘述-中文: 近年來立體視訊擷取與顯示技術逐日成熟，跟立體視訊編解碼相關的研究也開始熱絡起來，而隨著3D攝影機與3D顯示器的價格逐漸平民化，使得消費性立體視訊的應用日益普及，所以ITU-T也在2010將3D立體高階檔次(Stereo High Profile)增修到H.264 MVC規範中，來支援普及性較高的雙眼立體視訊應用，例如：藍光光碟的3D影片壓縮即是使用H.264的3D立體高階檔次。本技術提供高解析度3D立體視訊硬體解碼器IP，符合MVC Stereo High Profile規範，並且向下相容H.264 High Profile標準，可提供國內廠商高品質3D影像服務所需的關鍵技術，並可與現有成果之編解碼IP相互結合，在單一核心即可支援H.264與MVC規格，進而降低成本並帶動國內3D視訊廠商技術之升級，提昇其國際競爭力。 本計畫的定位在於開發在MVC與High Efficiency Video Coding (HEVC)技術，計畫團隊除了持續關注視訊技術的發展趨勢來開發新技術之外，對既有MPEG-2/4、H.264、Scalable Video Coding (SVC)以及AVS等相關應用領域，也能配合不同的需求來提供最佳化的整合解決方案，達到支援各類研發計畫的目的，並提供產業界完整的視訊編解碼IP。
技術現況敘述-英文: (空)
技術規格: 1. Fully-hardware-type decoder, which is compliant to ITU-T: – Stereo High Profile, Level 4.1, for 3D TV applications – Constrained Baseline / Main / High Profiles, Level 4.1, for HDTV applications 2. Picture resolution: 1920x1088p (HD), stereo view 60 fps, 50M bps, YCbCr 420 format (supports YV12 or NV12 format) 3. Supports ALL features in H.264 High Profile: – I/P/B-Slice, Interlaced Picture, 8x8 Intra Prediction, and 8x8 Inverse Transform – CABAC, Weighted Prediction, and Customized Quantization Matrix – Picture-/MB-level Adaptive Frame-Field (PIC-/MB-AFF) Structures – Up to 30 Reference Field-Pictures – Dedicated Hardware for Memory Management and Control Operations (MMCO) 4 Passes ITU-T H.264.1 conformance tests (total 174 cases, bit exactly matching) – Stereo High Profile: 1
技術成熟度: 實驗室階段
可應用範圍: 3D數位電視、多媒體手機等個人隨身的3D影音播放裝置、3D Video Codec相關產品領域、視訊串流與監控關鍵零組件。
本計畫的定位在於開發在MVC與High Efficiency Video Coding (HEVC)技術，計畫團隊除了持續關注視訊技術的發展趨勢來開發新技術之外，對既有MPEG-2/4、H.264、Scalable Video Coding (SVC)以及AVS等相關應用領域，也能配合不同的需求來提供最佳化的整合解決方案，達到支援各類研發計畫的目的，並提供產業界完整的視訊編解碼IP。
技術現況敘述-英文
(空)
技術規格
1. Fully-hardware-type decoder, which is compliant to ITU-T: – Stereo High Profile, Level 4.1, for 3D TV applications – Constrained Baseline / Main / High Profiles, Level 4.1, for HDTV applications 2. Picture resolution: 1920x1088p (HD), stereo view 60 fps, 50M bps, YCbCr 420 format (supports YV12 or NV12 format) 3. Supports ALL features in H.264 High Profile: – I/P/B-Slice, Interlaced Picture, 8x8 Intra Prediction, and 8x8 Inverse Transform – CABAC, Weighted Prediction, and Customized Quantization Matrix – Picture-/MB-level Adaptive Frame-Field (PIC-/MB-AFF) Structures – Up to 30 Reference Field-Pictures – Dedicated Hardware for Memory Management and Control Operations (MMCO) 4 Passes ITU-T H.264.1 conformance tests (total 174 cases, bit exactly matching) – Stereo High Profile: 1
技術成熟度
試量產
可應用範圍
3D數位電視、多媒體手機等個人隨身的3D影音播放裝置、3D Video Codec相關產品領域、視訊串流與監控關鍵零組件
潛力預估
本計畫的成果可以讓單一硬體核心就能實現H.264 High Profile與Multiview Video Coding (MVC)標準的解碼器架構，使得開發成本需求較低而且又能維持高效能與高解析度的性能，可提供國內廠商高品質3D影像服務所需的關鍵技術，提昇國內影像相關產業之競爭力。成熟技術。
技術現況敘述-中文: 本計畫的定位在於開發在MVC與High Efficiency Video Coding (HEVC)技術，計畫團隊除了持續關注視訊技術的發展趨勢來開發新技術之外，對既有MPEG-2/4、H.264、Scalable Video Coding (SVC)以及AVS等相關應用領域，也能配合不同的需求來提供最佳化的整合解決方案，達到支援各類研發計畫的目的，並提供產業界完整的視訊編解碼IP。
技術現況敘述-英文: (空)
技術規格: 1. Fully-hardware-type decoder, which is compliant to ITU-T: – Stereo High Profile, Level 4.1, for 3D TV applications – Constrained Baseline / Main / High Profiles, Level 4.1, for HDTV applications 2. Picture resolution: 1920x1088p (HD), stereo view 60 fps, 50M bps, YCbCr 420 format (supports YV12 or NV12 format) 3. Supports ALL features in H.264 High Profile: – I/P/B-Slice, Interlaced Picture, 8x8 Intra Prediction, and 8x8 Inverse Transform – CABAC, Weighted Prediction, and Customized Quantization Matrix – Picture-/MB-level Adaptive Frame-Field (PIC-/MB-AFF) Structures – Up to 30 Reference Field-Pictures – Dedicated Hardware for Memory Management and Control Operations (MMCO) 4 Passes ITU-T H.264.1 conformance tests (total 174 cases, bit exactly matching) – Stereo High Profile: 1
技術成熟度: 試量產
可應用範圍: 3D數位電視、多媒體手機等個人隨身的3D影音播放裝置、3D Video Codec相關產品領域、視訊串流與監控關鍵零組件
潛力預估: 本計畫的成果可以讓單一硬體核心就能實現H.264 High Profile與Multiview Video Coding (MVC)標準的解碼器架構，使得開發成本需求較低而且又能維持高效能與高解析度的性能，可提供國內廠商高品質3D影像服務所需的關鍵技術，提昇國內影像相關產業之競爭力。成熟技術。
本計畫的成果可以讓單一硬體核心就能實現H.264 High Profile與Scalable Video Coding (SVC)標準的解碼器架構，使得開發成本需求較低而且又能維持高效能與高解析度的性能，符合異質網路上對多重規模解碼功能的需求。
技術現況敘述-英文
(空)
技術規格
1. Fully-hardware-type decoder, which is compliant to ITU-T: – H.264 Baseline, Main, and High Profiles, Level 4.1 – SVC Scalable Baseline, Scalable High, and Scalable High-Intra Profiles, Level 4.1 2. Picture resolution: 1920x1088p (HD), 30 fps, 50M bps, YCbCr 420 format (supports YV12 or NV12 format) 3. Supports ALL features in H.264 High Profile: – I/P/B-Slice, Interlaced Picture, 8x8 Intra Prediction, and 8x8 Inverse Transform – CABAC, Weighted Prediction, and Customized Quantization Matrix – Picture-/MB-level Adaptive Frame-Field (PIC-/MB-AFF) Structures – Up to 30 Reference Field-Pictures – Dedicated Hardware for Memory Management and Control Operations (MMCO) 4. Supports SVC features: – Temporal, Quality, and Spatial Scalabilities – Coarser Gain Scalability (CGS), Medium Gai
技術現況敘述-中文: 本計畫的成果可以讓單一硬體核心就能實現H.264 High Profile與Scalable Video Coding (SVC)標準的解碼器架構，使得開發成本需求較低而且又能維持高效能與高解析度的性能，符合異質網路上對多重規模解碼功能的需求。
技術現況敘述-英文: (空)
技術規格: 1. Fully-hardware-type decoder, which is compliant to ITU-T: – H.264 Baseline, Main, and High Profiles, Level 4.1 – SVC Scalable Baseline, Scalable High, and Scalable High-Intra Profiles, Level 4.1 2. Picture resolution: 1920x1088p (HD), 30 fps, 50M bps, YCbCr 420 format (supports YV12 or NV12 format) 3. Supports ALL features in H.264 High Profile: – I/P/B-Slice, Interlaced Picture, 8x8 Intra Prediction, and 8x8 Inverse Transform – CABAC, Weighted Prediction, and Customized Quantization Matrix – Picture-/MB-level Adaptive Frame-Field (PIC-/MB-AFF) Structures – Up to 30 Reference Field-Pictures – Dedicated Hardware for Memory Management and Control Operations (MMCO) 4. Supports SVC features: – Temporal, Quality, and Spatial Scalabilities – Coarser Gain Scalability (CGS), Medium Gai
本計畫的成果可以讓單一硬體核心就能實現H.264 High Profile與Scalable Video Coding (SVC)標準的解碼器架構，使得開發成本需求較低而且又能維持高效能與高解析度的性能，符合異質網路上對多重規模解碼功能的需求。
技術現況敘述-英文
(空)
技術規格
1. Fully-hardware-type decoder, which is compliant to ITU-T: – H.264 Baseline, Main, and High Profiles, Level 4.1 – SVC Scalable Baseline, Scalable High, and Scalable High-Intra Profiles, Level 4.1 2. Picture resolution: 1920x1088p (HD), 30 fps, 50M bps, YCbCr 420 format (supports YV12 or NV12 format) 3. Supports ALL features in H.264 High Profile: – I/P/B-Slice, Interlaced Picture, 8x8 Intra Prediction, and 8x8 Inverse Transform – CABAC, Weighted Prediction, and Customized Quantization Matrix – Picture-/MB-level Adaptive Frame-Field (PIC-/MB-AFF) Structures – Up to 30 Reference Field-Pictures – Dedicated Hardware for Memory Management and Control Operations (MMCO) 4. Supports SVC features: – Temporal, Quality, and Spatial Scalabilities – Coarser Gain Scalability (CGS), Medium Ga
技術現況敘述-中文: 本計畫的成果可以讓單一硬體核心就能實現H.264 High Profile與Scalable Video Coding (SVC)標準的解碼器架構，使得開發成本需求較低而且又能維持高效能與高解析度的性能，符合異質網路上對多重規模解碼功能的需求。
技術現況敘述-英文: (空)
技術規格: 1. Fully-hardware-type decoder, which is compliant to ITU-T: – H.264 Baseline, Main, and High Profiles, Level 4.1 – SVC Scalable Baseline, Scalable High, and Scalable High-Intra Profiles, Level 4.1 2. Picture resolution: 1920x1088p (HD), 30 fps, 50M bps, YCbCr 420 format (supports YV12 or NV12 format) 3. Supports ALL features in H.264 High Profile: – I/P/B-Slice, Interlaced Picture, 8x8 Intra Prediction, and 8x8 Inverse Transform – CABAC, Weighted Prediction, and Customized Quantization Matrix – Picture-/MB-level Adaptive Frame-Field (PIC-/MB-AFF) Structures – Up to 30 Reference Field-Pictures – Dedicated Hardware for Memory Management and Control Operations (MMCO) 4. Supports SVC features: – Temporal, Quality, and Spatial Scalabilities – Coarser Gain Scalability (CGS), Medium Ga
執行單位: 工研院電子所 | 產出年度: 94 | 產出單位: | 計畫名稱: 電子關鍵性材料與整合模組發展四年計畫 | 領域: | 技術規格: Test Vehicle：Thermosonic ball bond with 25μm or 30μm Au wire_x000D_詳細規格視銅晶片來源而定，並由電子所與合作廠商共同 | 潛力預估: Filing two patents for copper chip package_x000D_，Cu/barrier/Al or Ni/Au cap可自製_x000D_，Wire bond qua...
執行單位: 工研院電子所 | 產出年度: 94 | 產出單位: | 計畫名稱: 電子關鍵性材料與整合模組發展四年計畫 | 領域: | 技術規格: Test Vehicle：Thermosonic ball bond with 25μm or 30μm Au wire_x000D_詳細規格視銅晶片來源而定，並由電子所與合作廠商共同 | 潛力預估: Filing two patents for copper chip package_x000D_，Cu/barrier/Al or Ni/Au cap可自製_x000D_，Wire bond qua...